Flir Thermal Camera

TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface

TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface
TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface
TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface
TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface

TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface    TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface

Resolution: 640x512 - 12° HFoV. 12 µm pixel pitch VOx microbolometer. 21 x 21 x 11 mm, (4.9 cm3) camera body. Weight as low as 7.5 grams. Low power consumption, starting at 500 mW.

The Boson® longwave infrared (LWIR) thermal camera module sets a new standard for size, weight, power, and performance (SWaP). It utilizes FLIR infrared video processing architecture to enable advanced image processing and several industry-standard communication interfaces while keeping power consumption low. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions - 640 x 512 or 320 x 256. It is available with multiple lens configurations, adding flexibility to integration programs.

With a weight as low as 7.5 g and a camera body as small as 21 x 21 x 11 mm, the Boson represents an industry-leading reduction in SWaP with no reduction in performance. Advanced embedded processing and video analytics, as well as software-customizable functionality, give this small camera big capabilities, including integration with auxiliary sensors such as third-party cameras, GPS, and IMU. DRAMATIC REDUCTION IN SIZE, WEIGHT AND POWER (SWaP) WITH NO REDUCTION IN PERFORMANCE.

A full-featured VGA thermal camera module at less than 4.9 cm. 21 x 21 x 11 mm camera body and weight as low as 7.5 g. 12 µm pixel pitch VOx microbolometer with 320 and 640 resolutions.

POWERFUL INFRARED VIDEO PROCESSING ARCHITECTURE. FLIR infrared video processing with embedded industry-standard interfaces empowers advanced processing and analytics.

Includes embedded algorithms for noise filters, gain control, blending, and more. Software-customizable functionality for video processing and power dissipation requirements.

Built-in support for physical and protocol-level interface standards. WIDE CONFIGURABILITY FOR FASTER DEVELOPMENT AND LOWER COST-TO-MARKET. Unprecedented integration flexibility for fast, affordable developments. Customized applications through FLIR-trusted third party developers.

Mechanical/electrical compatibility across all versions. Variety of hardware and image processing integration to fit OEM requirements.

7.5 g without lens (configuration dependent). Dimensions (L x W x H).

21 × 21 × 11 mm without lens. 60Hz baseline; 30 Hz runtime selectable. Adjustable (vertical flip and/or horizontal flip). 640 x 512 12° HFoV 36mm (EFL). Factory calibrated; updated FFCs with FLIR's Silent Shutterless NUC (SSNT).

Full-frame snapshot, SDIO interface to support removable media. Re-writable each frame; alpha blending for translucent overlay.

12 km (max altitude of a commercial airliner or airborne platform). Varies by configuration; as low as 500 mW. Four tapped M1.6x0.35 (rear cover).

Lens support recommended when lens mass exceeds core mass. This item is in the category "Business & Industrial\Test, Measurement & Inspection\Cameras & Imaging\Infrared & Thermal Imaging". The seller is "ckone90" and is located in this country: US. This item can be shipped to United States.
  • Product: LWIR Thermal Camera
  • Thermal Sensitivity: 30mK
  • Field of View: 640 X 512
  • MPN: 20640A012
  • Temperature Range: -40C to 80C
  • Brand: FLIR

TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface    TELEDYNE FLIR BOSON 640 X 512 36MM 12° HFOV LWIR CAMERA and USB Interface